Mass packaging
Business status: mass production customers have reached 53, with shipments reaching 63.5kk/month in October.
SiP package design and production
Mass packaging
SiP package design and production
Application | Bare Die Package | Advantages | Volume |
Remote control | MCU、RF transceiver modules SiP package | Compared to SoC,cost down 60%; shorten develop cycle(by 1 month),expedite time to market | 1.0kk/month |
Security | MCU、Bluetooth、BLE、passives SiP package | Compared to system board, much less area (85% reduction), easy installation and better reliability | 1.5kk/month |
NB-IoT | NB-IoT、Flash SiP package | Compared to eFlash SoC,lower cost and higher yield | 200k/month |
MCU | 32bit M4 MCU 、Flash SiP package | Compared to eFlash SoC,lower cost and higher yield | 600k/month |
Smart Robotics | Image processing, MCU SiP package | Compared to eFlash SoC,lower cost and higher yield | 200k/month |
3D deep learning | 3D sensor、3D ASIC SiP package | Small size and high performance to price ratio | 200k/month |