Introduction
MooreElite strives to provide ASIC design and Turnkey solutions, from Spec/FPGA/Algorithm to chip delivery. Our services include but are not limited to: chip architecture planning, IP selection, digita/analog frontend design, DFT, digital /analog verification, physical design, layout, tape-out, assembly and testing services. Our team has been serving customers with knowledge of how to get the most out of silicon since 2012, offering maximum flexibility with Turnkey, NRE, consulting and on-site support services.
Service List
Turnkey
- Spec to chip
- FPGA to chip
- Algorithm to chip
NRE
- FPGA to GDS
- RTL to GDS
- Netlist to GDS
Professional consultation/onsite services
- Digital front end design
- DFT
- Analog design
- Digital backend
- Digital verification
- Analog layout
Strength
Advanced design methodology
- Low power design
- Multi power domain design
- Mix-signal design
- High speed circuit design
- RF circuit design
Mature design flow
- Synopsys flow
- Cadence flow
- Mentor flow
- ANSYS flow
Excellent service
- Secure design center
- Experienced design team
- Proven design processes
- Great customer satisfaction
Advanced design methodology
- Low power design
- Multi power domain design
- Mix-signal design
- High speed circuit design
- RF circuit design
Mature design flow
- Synopsys flow
- Cadence flow
- Mentor flow
- ANSYS flow
Excellent service
- Secure design center
- Experienced design team
- Proven design processes
- Great customer satisfaction
Extensive project experience
- CPU: TSMC 28HPC, 1P10M, 14mm*6mm
- AR: UMC 28HPC, 5mm*4.5mm
- AP+BB: TSMC 40nm, 1P7M, 4.35mm*4.3mm
- AP: SMIC 28nm/TSMC 28nm/UMC 28HPC
- Blockchain: GF 22nm/Samsung 14nm/Samsung 10nm
- IoT: SMIC 55nm/UMC 55nm/TSMC 55nm
Comprehensive IP solution
Cloud.mooreElite.com/ip
Self-developed IP sharing cloud platform to provide cost-effective IP solution quickly and accurately
Work with partners to launch a customizable lightweight SoC IP platform for the IoT field
Work with partners to launch a customizable lightweight SoC IP platform for the IoT field
Expert teams
- 100+ engineers in total，master and doctor’ s degree > 40%
- Rich working experience, 58% of engineers > 5-year working experience, expert in advanced technology nodes
- High effficiency and quality delievery
Successful Cases
| Chip Application | Process | |
| IoT | NBIoT | 40ULP |
| IoT | 55eflash | |
| SoC | Networking | 16nm |
| Networking | 14nm | |
| Navigation SoC | 40nm | |
| Modem Chip | 28nm | |
| Modem Chip | 16nm | |
| AP | 28nm | |
| AP | 16nm | |
IC Design Solution
(1) BLE IoT Bridge IP Turnkey Solutions
(1) BLE IoT Bridge IP Turnkey Solutions
Process diagram
Process diagram
Application field
- Smart thermometer, blood pressure monitor, blood glucose meter
- Weight scale
- Smart location beacon
- Smart label
- Mobile Credit Card Machine (mPOS)
- Remote control toys
Solution advantages
- The easiest BLE data exchange API customized for MCU programmers without BLE basics
- Certified BT 5.0 Bluetooth Low Energy controller sub-system
- Excellent RF performance and anti-interference ability
- Integrated PMU and DC/DC
(2) RF IP Turnkey Solutions
(2) RF IP Turnkey Solutions
Process diagram
Application area
- Smart grid and mesurement
- Lighting control
- Wireless network, sensor network
- Environmental monitoring
- Smart home
- Vehicle management
- Wireless alarm security system
- Remote telemetry
- Industrial automation equipment
- Building control
- Wireless meter reading
- Smart grid and mesurement
- Lighting control
- Wireless network, sensor network
- Environmental monitoring
- Smart home
- Vehicle management
- Wireless alarm security system
- Remote telemetry
- Industrial automation equipment
- Building control
- Wireless meter reading
Solution advantages
- Long transmission distance, low power consumption, high anti-interference ability, low cost
- 200K-6MHz adjustable bandwidth
- Applied to the National Grid Ubiquitous Electric Internet of Things